| 常见技术参数（Technical Parameter) | ||
| 项目 | 技术标准 | |
| 层数 | 1-12 layers | |
| 材料 | CEM-3，FR-4 | |
| 板层 | 0.2mm-3.20m(8mil-126mil) | |
| 最小芯板厚 | 0.1mm(4mil) | |
| 铜厚 | 1/2 oz min； 3 oz max | |
| 最小线宽间距 | 0.075mm(3mil) | |
| 最小钻孔径 | 0.20mm(10mil) | |
| 最小冲孔孔径 | 0.9mm(35mil) | |
| 公差 | 钻孔孔位 | ±0.075mm(3mil) |
| 线宽 | ±0.05mm(2mil)或线宽的 ±20﹪ | |
| 孔径 | PTH±0.075mm(3mil) NPTH±0.05mm(2mil) |
|
| 外型公差 | 铣床：±0.15mm(6mil) 冲床：±0.10mm(4mil) |
|
| 翘曲度 | 0.70﹪-1.5﹪ | |
| 焊盘表面处理 | Nickel/Gold Plating/Entek/Hot Air Leveling | |
| 绝缘电阻 | 10K-20MΩ | |
| 传导电阻 | ﹤50Ω | |
| 测试电压 | 300v | |
| V刻 | 拼板尺寸 | 110*100mm(min.)660*600mm(max.) |
| 板厚 | 0.6mm(24mil)min. | |
| 保留厚度 | 0.3mm(12mil)min. | |
| 公差 | ±0.1mm(4mil) | |
| 槽宽 | 0.50mm(20mil)max. | |
| 槽到槽 | 10mm min | |
| 槽到线 | 0.5mm(20mil)min | |
| 槽 | Slot size tlo.≧2W公差 | PTHL:±0.15mm(6mil) W:±0.1mm(4mil) |
| NPTH: ±0.125mm(5mil) W:±0.1mm(4mil) |
||
| 最小孔到圆形距离 | PTH Hole: 0.13mm(5mil) NPTH Hole: 0.18(7mil) |
|
| 多层板 | 圆形偏差 Tolerance of Hole and round pad |
0.075mm(3mil) |
| 层间偏差 | 4 layers: 0.15mm(6mil)max 6 layers: 0.025mm(10mil)max. |
|
| 最小孔径至内层圆形距离 | 0.25mm(10mil) | |
| 最小板边到内圆形距离 | 0.25mm(10mil) | |
| 板厚公差 | 6 layers: ±0.15mm(6mil) 6 layers: ±0.15mm(6mil) |
|
| 特性阻抗 | 60Ω±10﹪ | |
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